電路板電鍍膜厚無損(sun)檢(jian)測儀(yi) 金屬行業精確(que)定(ding)量分(fen)(fen)析(xi)軟件。可(ke)同時分(fen)(fen)析(xi) 8 種元(yuan)素。最小(xiao)二乘法(fa)計算峰(feng) 值(zhi)反(fan)卷積。采用(yong)盧卡斯(si)-圖思計算方(fang)法(fa)進行矩陣(zhen)校正及內部元(yuan)素作用(yong)分(fen)(fen)析(xi)。金屬分(fen)(fen)析(xi)精度(du)可(ke)達±0.02%,貴金屬(8-24 Karat) 分(fen)(fen)析(xi)精度(du)可(ke)達±0.05kt Multi-Ray. 對鍍液進行分(fen)(fen)析(xi)。采用(yong)不同的數(shu)學(xue)計算方(fang)法(fa)對鍍液中(zhong)的金屬離子進行測定(ding)。含(han)全(quan)元(yuan)素、內部元(yuan)素、矩陣(zhen)校正模塊。
金屬(shu)(shu)(shu)電鍍(du)層檢測儀(yi)(yi)器 金屬(shu)(shu)(shu)電鍍(du)檢測儀(yi)(yi)定(ding)性定(ding)量分析(xi)(xi):可(ke)定(ding)性分析(xi)(xi)20多種(zhong)金屬(shu)(shu)(shu)元素(su),并可(ke)定(ding)量分析(xi)(xi)成分含量. 光譜對(dui)比功(gong)能:可(ke)將樣(yang)品的(de)光譜和標準(zhun)件的(de)光譜進行對(dui)比,可(ke)確定(ding)樣(yang)品與標準(zhun)件的(de)差別,從而控(kong)制來料(liao)的(de)純度. 統(tong)(tong)(tong)計功(gong)能:能夠將測量結果進行系統(tong)(tong)(tong)分析(xi)(xi)統(tong)(tong)(tong)計,方便有效(xiao)的(de)控(kong)制品質.
金屬電(dian)鍍(du)(du)(du)層(ceng)檢測(ce)儀 金屬電(dian)鍍(du)(du)(du)檢測(ce)儀綜合(he)性能:鍍(du)(du)(du)層(ceng)分(fen)析(xi)(xi)(xi) 鍍(du)(du)(du)層(ceng)分(fen)析(xi)(xi)(xi):可(ke)分(fen)析(xi)(xi)(xi)單層(ceng)鍍(du)(du)(du)層(ceng),雙層(ceng)鍍(du)(du)(du)層(ceng),三層(ceng)鍍(du)(du)(du)層(ceng), 合(he)金鍍(du)(du)(du)層(ceng). 鍍(du)(du)(du)液分(fen)析(xi)(xi)(xi):可(ke)分(fen)析(xi)(xi)(xi)鍍(du)(du)(du)液的(de)主成份濃(nong)度(如鍍(du)(du)(du)鎳藥(yao)水(shui)的(de)鎳離子(zi)濃(nong)度,鍍(du)(du)(du)銅藥(yao)水(shui)的(de)銅離子(zi)濃(nong)度等),簡單的(de)核對方式,無需購買標準藥(yao)液.